Henkel TechnoMelt® Cool 250F – Hot Melt Adhesive
Technomelt® Cool 250F has a low viscosity for application of 250°F to improve safety and reduce energy costs. Technomelt® Cool 250F has an outstanding thermal stability to prevent char formation, reduce maintenance costs, and extend service life.
- Excellent adhesion to difficult board stock including recycled and high performance liners.
- Excellent balance of heat resistance and cold adhesion.
- Fast setting for high speed applications.
Technical Data Sheet
Henkel Technomelt® Cool 250F – Hot Melt Adhesive
MDSD Download
Henkel Technomelt® Cool 250F – Hot Melt Adhesive
